In the previous post, we discussed the various types of Rogers and Arlon materials used by Rigiflex Technology to manufacture printed circuit boards, and printed wiring boards. This post is a continuation, elaborating on the materials created by DuPont and Isola.
A Look at Rigiflex’s PCB Manufacturing Materials
Rigiflex utilizes four materials created by DuPont, and five materials created by Isola. Most of these materials are used in high performance applications.
- FR: This term refers to different types fire retardant materials. One of the most popular types is FR-4. This is a type of laminated glass epoxy sheet made from woven fiberglass. It is made flame resistant by the addition of an epoxy resin binder. Generally, FR materials are known for their flexibility (50,000 to 64,000 PSI), great tensile strength (45,000 PSI), high dielectric strength (20 MV/m), and practically zero water absorption.
- LF: Also known as Pyralux LF, this refers to a group of bondplys, coverlays, and sheet adhesives. They are designed with acrylic copper sheathing. As a material, LF provides benefits of zero halogens, immense bonding strength, thermal resistance, and a wide processing range.
- Pyralux AP: This is a laminate composed of polyimide and copper clad on both sides. It is known for excellent thermal, moisture, and insulation resistance. Pyralux AP is an extremely reliable material to use when creating single and multilayer flexible circuitry.
- High Speed Pyralux TK: This is a double sided, copper clad bondply, and laminate. The primary composite can be created using either polyimide or a fluoropolymer. The term TK stands for Teflon-Kapton. Pyralux TK is a material specially designed for digital and flexible circuits, which are used in high frequency applications. The use of the bondply allows for electrical insulation, and protection against environmental elements.
- 370HR: This material comprises a combination of a high performance epoxy resin, and glass fabric. Provided as prepreg and laminate products, 370HR is known for its thermal performance, as well as immense resistance to moisture, chemical, and mechanical elements in an application.
- FR406: A well-known high performance epoxy material, FR406 has a glass temperature of 338oF. This allows it to maintain its performance in environments comprising thermal excursions. It can be processed as a general FR4 material, and be provided as prepregs, and with copper foil cladding.
- FR408: This is a high performance version of the FR4 epoxy laminate. It has a glass temperature of 356oF, and is compatible with all FR4 processes. It is an ideal material for PCBs that are used in applications with high speeds and signal integrity.
- Polyimide: This refers to different types of polyimide materials and products used by Rigiflex for high temperature circuit applications. The types include solid prepreg materials, copper clad laminates, and polyimide core materials.
- High Speed FR408HR: This FR4 type material is primarily known for its high glass temperature of 446oF. It is particularly used for multilayer PWB applications, which require immense thermal performance, and high operating temperatures.
By offering a wide range of high performance PCB materials, Rigiflex has the capability to take on complex PCB and PWB requirements. The PCB products undergo thorough design, prototyping, and testing procedures. Only products of the highest quality are delivered to the clients. This is why Rigiflex is regarded as a leading circuit board manufacturer.