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4 Layer Rigid-Flex PCB with 2 Layer Flex PCB in Break Away Panel Form

Rigid-flex PCBs combines rigid and flexible board technologies together. This makes them ideal for a wide range of applications. The typical rigid-flex PCB circuit consists of two or more conductive layers that comprise either rigid insulation or flexible material between each one. Rigid-flex PCBs offers various advantages including quality control and higher component density. At Rigiflex Technology, Inc. we specialize in a wide range of flexible circuit boards including rigid flex board. We offer 4 layers rigid-flex PCB with 2 layer flex PCB in breakaway panel form, where the breakaway panels are created using the tab routing. These panels are designed such that they do not sag during reflow or wave soldering. These panels remain attached to the PCB during the assembly process and are removed just before the inspection phase.

4 Layer Rigid-Flex PCB with 2 Layer Flex PCB in Break Away Panel Form
Model: Rigid-flex board-4L
Layers: 4
Material: FR4+Polyimide
Surface treatment: immersion gold
Width/space: 8/8mil
Finish thickness: 0.2mm(flex),1.0mm
Min Hot: 0.8mm

The printed board circuit board consists of 4 layers made from FR4+polyamide material. The 4 layer PCB board can be provided in varying thicknesses from 0.5mm ~ 3.0mm, with maximum panel size up to 18″x 24″. These rigid-flex PCBs have specific current requirements in different applications, so they need specific copper thicknesses. We can design these PCBs in different copper thicknesses such as 0.5 OZ, 1.0 OZ up to 6 OZ. Typically, surface finishes are applied on the PCB to ensure solderability and protect exposed copper circuitry. We offer many types of surface treatment for PCBs including Immersion Tin, OSP/Entek, Gold and HASL. Silkscreening helps improve the readability of the PCB. At Rigiflex, we PCBs in silkscreen colors – black and white. The PCBs can be offered in vacuum packaging or individual plastic bags, as this help protect them in transit.

Being a leading rigid printed board manufacturer, Rigiflex Technology, Inc. provides quality services to our client to ensure that they meet various industry standards, as well as maximize the performance of printed circuit boards. Whatever your needs, you can count on us

OEM Custom Service
Board Thickness :0.5mm~3.0mm (0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 18″*24″
Packing: Vacuum/Plastic bag
Layer: 1 – 20 layers

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

 

1~20(Rigid-Flex &
Multilayers FPC)

1~2

 

 

Single Sided

0.050 mm

 

 

Double Sided

0.075 mm

 

 

Drilling P.T.H.

0.2 mm

 

 

Punching

1.0 mm

 

 

Conductor Width
(W)

0.025 mm

W0.5mm

 

Hole Diameter (H)

0.05 mm
(withP.T.H.0.1mm)

H1.5mm

 

Accumulated Pitch
(P)

0.05 mm
(Special0.03mm)

P25mm

 

Outline Dimension
(L)

0.05 mm

L50 mm

 

Conductors and Outline
(C)

0.15 mm (Special
0.07mm)

C5.0 mm

 

Conductors and
Coverlay

0.3~0.5 mm

 

Surface Treatment
on

Soft or Hard Ni/Au Sn/Pb
(2~60µm)

Primary FluxCarbon
Printed

4~10µm Silver Gel
printed

 

Terminals and land
Areas

Insulation
Resistance

1000MW

IPC-TM-650
2.6.3.2

at Ambient

Dielectric
Strength

5KV

IPC-TM-650
2.5.6.1

Surface Resistance
(W)

5×012

2×015

IPC-TM-650
2.5.17

Volume Resistivity
(W-cm)

1×015

1×015

IPC-TM-650
2.5.17

Dielectric Constant (1
MHz)

4

3.4

IPC-TM-650
2.5.5.3

Dissipation Factor (1
MHz)

0.04

0.02

IPC-TM-650
2.5.5.3

Peeling Strength (180
irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650
2.4.9

Solder Heat
Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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