4 Layer Rigid-Flex PCB with ENIG Finish

Being the leading rigid flex printed circuit board manufacturer, Rigiflex provides them in different custom sizes and surface finishes. This 4-layer rigid-flex PCB with ENIG finish is ideal for applications that involve ball grid arrays, as well as surface mount devices. The basic material used for its construction includes polyimide, as well as FR4. The polyimide helps improve the temperature resistance of this circuit board and makes it ideal for high temperature applications.

ENIG is an abbreviation of Electroless Nickel Immersion Gold. It is basically a two layer coating of 2-8 μin Au over 120-240 μin Ni. The components are soldered to the nickel layer, and it creates a barrier over the copper. Necessary protection during the storage is provided by the gold. The gold also offers low contact resistance that is required by thin deposits of gold. This is one of the most widely used finishes in the PCB industry due to its compliance with RoHS regulations.

We can provide the printed circuit boards in various sizes, from small to large. The maximum panel size offered is 18″x24″, whereas board thicknesses can easily vary from 0.5mm~3.0mm (0.02″~0.12″). The outlines are created by methods such as routing, V-cut, and punching. We use laser equipment that helps us achieve finish thickness as small as 0.2mm (flex), and 1.0mm.

4 Layer Rigid-Flex PCB with ENIG Finish
Model:	Rigid-flex board-4L
Layers:	4
Material:	FR4+Polyimide
Surface treatment:	immersion gold
Width/space:	8/8 mil
Finish thickness:	0.2mm(flex),1.0mm
Min Hot:	0.8mm

Every printed circuit board depends on the copper for carrying electricity. We understand that copper thickness plays a key role in the performance of these circuit boards. Thus, we allow the customers to choose from a variety of copper thicknesses, including 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ. The solder mask helps in improving the aesthetic appeal of the components on the PCB. We can provide rigid–flex printed circuit boards in various solder mask colors, including white, black, blue, green, red, and Taiyo PSR4000 white. The PCB can be availed in silkscreen colors – black and white.

Rigid-flex printed circuit boards have minimal space requirements that are optimized by 3D application. These circuit boards require no cables or connectors between the rigid parts. This helps reduce the board size, as well as overall system weight. These lesser solder joints also help assure high connectivity. Additionally, these boards have ZIF contacts that are integrated. These contacts help simplify the system interfacing. This 4 layer rigid-flex PCB and other printed circuit boards are vacuum packed during the transit. This helps us assure the quality, as well as working condition of the boards.

OEM Custom Service
Board Thickness	0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:	0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline:	Routing, punching, V-Cut
Solder mask:	White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color:	Black/White
Surface finishing:	Immersion Gold, HASL, OSP
Max Panel size:	18″*24″
Packing:	Vacuum/Plastic bag
Layer:	1 – 20 layers

SPECIFICATION
Materials		Polyimide	Polyester ( PET)	Remark&
		(Kapton)		Test Method
		1~20(Rigid-Flex & Multilayers FPC)	1~2
	Single Sided	0.050 mm
	Double Sided	0.075 mm
	Drilling P.T.H.	0.2 mm
	Punching	1.0 mm
	Conductor Width (W)	0.025 mm		W0.5mm
	Hole Diameter (H)	0.05 mm (withP.T.H.0.1mm)		H1.5mm
	Accumulated Pitch (P)	0.05 mm (Special0.03mm)		P25mm
	Outline Dimension (L)	0.05 mm		L50 mm
	Conductors and Outline (C)	0.15 mm (Special 0.07mm)		C5.0 mm
	Conductors and Coverlay	0.3~0.5 mm
Surface Treatment on		Soft or Hard Ni/Au Sn/Pb (2~60µm) Primary FluxCarbon Printed 4~10µm Silver Gel printed
Terminals and land Areas
Insulation Resistance		1000MW		IPC-TM-650 2.6.3.2
				at Ambient
Dielectric Strength		5KV		IPC-TM-650 2.5.6.1
Surface Resistance (W)		5×012	2×015	IPC-TM-650 2.5.17
Volume Resistivity (W-cm)		1×015	1×015	IPC-TM-650 2.5.17
Dielectric Constant (1 MHz)		4	3.4	IPC-TM-650 2.5.5.3
Dissipation Factor (1 MHz)		0.04	0.02	IPC-TM-650 2.5.5.3
Peeling Strength (180 irection)		1.2kgf/cm	1.2kgf/cm	IPC-TM-650 2.4.9
Solder Heat Resistance		260 .C/10secs	210 .C/3secs
Flammability		94 V-0	94VTM-0	UL94
Water Absorption		2.90%	1.00%	ASTM D570%
				(24 Hours)