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10 Layer Rigid-Flex PCB with Selective Coverlay

For a few years now, the popularity of rigid-flex or rigid flexible printed circuit boards (PCBs) has sky-rocketed. One of the major reasons behind this increasing popularity is that you can integrate multiple PCB assemblies, and other elements. The flex circuit substrate in the rigid-flex PCB provides the backbone required by the wiring. On the other hand, the rigid multilayer circuit sections can be built as modules. If you are looking for an experienced rigid flex PCB manufacturer in US, then your search ends here. Rigiflex has been manufacturing rigid flex PCBs for several years now, and this has helped it to achieve the expertise. The 10 layer rigid-flex PCB with selective coverlay is one of the leading PCBs provided by us.

At Rigiflex, we aim at designing and developing rigid flex printed circuit boards that cater to a wide range of application requirements. We employ immersion gold surface treatment for the 10 layer Rigid flex PCBs that we design and build. The finish thickness of these PCBs is 0.2 mm (flex), 1.6 mm. We can provide you a wide range of solder mask options, such as red, green, blue, black, white, and Taiyo PSR4000 White. The copper thickness of the printed circuit boards that we manufacture can vary from 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ. We have the capability to provide you printed circuit boards in different board thicknesses, varying from 0.5 mm ~ 3.0 mm (0.02″~0.12″). The legend/silkscreen color can be either black or white. You can choose from a variety of surface finish options, such as immersion gold, HASL, and OSP. We have the capability to manufacture these PCBs in different layer options from 1 layer to 20 layers.

10 Layer Rigid-Flex PCB with Selective Coverlay
Model: Rigid Flex PCB
Material: FR4+PI
Surface treatment: immersion gold
4/4 mil
Finish thickness: 0.2mm(flex), 1.6mm
Min Hot: 0.1mm

These printed circuit boards can be manufactured single sided (0.050 mm), double sided (0.075 mm), and drilling plated through-hole (0.2 mm). The conductor width is 0.025 mm, whereas the hole diameter is 0.05 mm. The outline dimension is 0.05 mm. These PCBs have a dielectric strength of 5 K, and an insulation resistance of 1000 MW.

Along with designing 10 layer rigid flexible PCBs, we can also provide you with the following services:

  • Premium Material Sets
  • Heat Sink Application
  • Rigid-Flex with HDI
  • Innovative Rigid-Flex Processes

At Rigiflex, we believe that gaining customers’ trust requires one to provide them quality products and services. This has always helped us in designing and developing high-quality 10 layer rigid flex printed circuit boards with selective coverlay. Are you interested to know more about these PCBs or other circuit boards that we can manufacture? Give us a call today. You can also send us your queries and requirements via email, and our prompt professionals will help you. Also, you can request a quote for the required printed circuit board.

OEM Custom Service
Board Thickness 0.5mm~3.0mm (0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 18″*24″
Packing: Vacuum/Plastic bag
Layer: 1 – 20 layers

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex &
Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width
(W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm
(withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch
(P)

0.05 mm
(Special0.03mm)

P25mm

Outline Dimension
(L)

0.05 mm

L50 mm

Conductors and Outline
(C)

0.15 mm (Special
0.07mm)

C5.0 mm

Conductors and
Coverlay

0.3~0.5 mm

 

Surface Treatment
on

Soft or Hard Ni/Au Sn/Pb
(2~60µm)

Primary FluxCarbon
Printed

4~10µm Silver Gel
printed

 

Terminals and land
Areas

Insulation
Resistance

1000MW

IPC-TM-650
2.6.3.2

at Ambient

Dielectric
Strength

5KV

IPC-TM-650
2.5.6.1

Surface Resistance
(W)

5×012

2×015

IPC-TM-650
2.5.17

Volume Resistivity
(W-cm)

1×015

1×015

IPC-TM-650
2.5.17

Dielectric Constant (1
MHz)

4

3.4

IPC-TM-650
2.5.5.3

Dissipation Factor (1
MHz)

0.04

0.02

IPC-TM-650
2.5.5.3

Peeling Strength (180
irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650
2.4.9

Solder Heat
Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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