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Nowadays, many applications are using rigid printed circuit boards for their compact circuitry. Besides this, the rigid PCBs tend to produce low electronic noise. This is one of the crucial reasons adding to the increased popularity of these PCBs. They can come in a various layer and finish options. Rigiflex has a vast experience in design and development of such printed circuit boards. We can help you design 2 layer Teflon rigid printed circuit board with ENIG finish.
The material that we use to manufacture these PCBs is Teflon. Being a non-viscous material, Teflon has a capability to deliver high performance even in high temperature applications. In addition to this, the other beneficial features of Teflon include resistance to corrosion, abrasion, moisture, and heat.
We regularly deliver Teflon rigid PCBs with Electro Nickel Immersion Gold (ENIG) finish to clients in various industries. The oxidation of nickel is prevented by the immersion gold. Besides this, the ENIG provides a flat and level finish. Furthermore, in the PCB manufacturing processes, ENIG finish is easy to use, particularly during circuit board soldering. When Teflon material is used in a printed circuit board with an ENIG finish, the combination of the material and finish forms an organic base material. This helps prevent circuit loss and conductivity issues.
The board thickness of the 2 layer Teflon rigid PCB with ENIG finish that we manufacture is 1.6 mm, and copper thickness is 1 OZ. The minimum line width/spacing, and hole size of these PCBs is 5 mil. Apart from ENIG finish, we can provide you PCBs in various other finishes, such as HASL, HASL lead-free, OSP, flash gold, gold fingers, carbon ink, and immersion gold/tin/silver.
We, at Rigiflex, are known to design and manufacture 2 layer Teflon rigid PCBs at affordable prices in the US. However, the quality of PCBs manufactured do not compromise on the quality and have capability to deliver high performance. Give us a call for more information about these PCBs, or request a quote.
2 Layer Teflon Rigid PCB with ENIG Finish | |
Model: | 2L PCB |
Base Material: | 1L, FR4 |
Board Thickness: | 1.6 mm |
Copper Thickness: | 1OZ |
Min. Hole Size: | 5mil (0.125mm) |
Min. Line Width/ Spacing: | 5/5mil |
Solder mask/ Silkscreen Color: | No soldermask / no silkscreen. Lowest cost way. |
Surface Finishing: | HASL Lead Free |
Rigid PCB Capability | |||
No. | Item | Technical data | |
1 | Layer Count | 1-30Layers | |
2 | HDI Type | 1+N+1, 2+N+2 | |
3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc | |
4 | Board thickness | 0.2~5.0mm | |
5 | Board Size | Max. | 18”x24” |
Min. | 30x50mm | ||
6 | Copper Thickness | Outer layer | 1oz~6oz |
Inner layer | Hoz~5oz | ||
7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
8 | Finished Hole size | Mechanical | 0.20~6.30mm |
Laser | 5mil, 6mil | ||
9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
10 | Aspect Ratio | 10:1 | |
11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
NPTH | ±0.05mm (2mil) | ||
12 | Hole Position Tolerance | ±0.05mm (2mil) | |
13 | Bow & Twist | ≤0.75% | |
14 | Peel strength | 1.4N/mm | |
15 | Thermal stress | 288℃ & 20 Sec | |
16 | Test Voltage | 50-300V | |
17 | Soldermask color | Green, Red, Blue, Black, White | |
18 | Silkscreen color | White, Black, Yellow | |
19 | Min. S/M Pitch | 4mil(0.1mm) | |
20 | Min. Solder Mask Clearance | 0.05mm | |
21 | Impedance Control Tolerance | +/-10% | |
22 | Outline Tolerance | ±0.10mm (4mil) | |
23 | Surface Finish | HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask |