10 Layer Rigid-Flex PCB with 2 Layer Flex/Stiffener Circuit Boards

With the rise in demand for flexible printed circuit boards, we at Rigiflex Technology, Inc. are also ready and eager to turn your concepts into reality. As a prominent rigid flex PCB manufacturer, we can build complex jobs like no-one else. Our engineers are experts in the making of a wide variety of rigid flex printed circuit boards, including 10 layer rigid-flex PCB with 2 layer flex/stiffener circuit boards. From prototype, low-to-mid volume to high volume production, we develop these specialized boards to best meet the requirements of industries such as telecommunication, military, medical, electronics, among others.

At Rigiflex, you can fabricate 10 layer rigid-flex PCB with 2 layer flex/stiffener circuit boards with board thickness 0.5mm~3.0mm (0.02″~0.12″) and copper thickness 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ. Considering the rigors of the application environments, these rigid flex circuit boards are surface treated and finished with immersion gold, HASL, OSP. This specialized treatment improves their corrosion resistance and robustness when used in critical applications. You can choose from White/Black/Blue/Green/Red, Taiyo PSR4000 white as the solder mask and Black/White as Legend/Silkscreen Color.

10 Layer Rigid-Flex PCB with 2 Layer Flex/Stiffener Circuit Boards
Model:	Rigid Flex PCB
Material:	FR4+PI
Surface treatment:	immersion gold
Width/space:	4/4mil
Finish thickness:	0.2mm(flex), 1.6mm
Min Hot:	0.1mm

Our capabilities in 10 layer rigid-flex PCB with 2 layer flex/stiffener circuit boards is much more! Each stage of the designing, manufacturing and assembly stage is under stringent quality checks to guarantee optimum quality and flawless operation when put to applications. Let us now your specialized requirements; we take care of your demands to the fullest and guarantee to deliver flexible circuit boards that are sturdy and capable to withstand harsh environments.

OEM Custom Service
Board Thickness	:0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:	0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline:	Routing, punching, V-Cut
Solder mask:	White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color:	Black/White
Surface finishing:	Immersion Gold, HASL, OSP
Max Panel size:	18″*24″
Packing:	Vacuum/Plastic bag
Layer:	1 – 20 layers

SPECIFICATION
Materials		Polyimide	Polyester ( PET)	Remark&
		(Kapton)		Test Method
		1~20(Rigid-Flex & Multilayers FPC)	1~2
	Single Sided	0.050 mm
	Double Sided	0.075 mm
	Drilling P.T.H.	0.2 mm
	Punching	1.0 mm
	Conductor Width (W)	0.025 mm		W0.5mm
	Hole Diameter (H)	0.05 mm (withP.T.H.0.1mm)		H1.5mm
	Accumulated Pitch (P)	0.05 mm (Special0.03mm)		P25mm
	Outline Dimension (L)	0.05 mm		L50 mm
	Conductors and Outline (C)	0.15 mm (Special 0.07mm)		C5.0 mm
	Conductors and Coverlay	0.3~0.5 mm
Surface Treatment on		Soft or Hard Ni/Au Sn/Pb (2~60µm) Primary FluxCarbon Printed 4~10µm Silver Gel printed
Terminals and land Areas
Insulation Resistance		1000MW		IPC-TM-650 2.6.3.2
				at Ambient
Dielectric Strength		5KV		IPC-TM-650 2.5.6.1
Surface Resistance (W)		5×012	2×015	IPC-TM-650 2.5.17
Volume Resistivity (W-cm)		1×015	1×015	IPC-TM-650 2.5.17
Dielectric Constant (1 MHz)		4	3.4	IPC-TM-650 2.5.5.3
Dissipation Factor (1 MHz)		0.04	0.02	IPC-TM-650 2.5.5.3
Peeling Strength (180 irection)		1.2kgf/cm	1.2kgf/cm	IPC-TM-650 2.4.9
Solder Heat Resistance		260 .C/10secs	210 .C/3secs
Flammability		94 V-0	94VTM-0	UL94
Water Absorption		2.90%	1.00%	ASTM D570%
				(24 Hours)