6 Layer Rigid-Flex PCB with 2 Layer Flex PCB and Stiffener

Being a leading rigid flex PCB manufacturer, Rigiflex specializes in complex rigid flex printed circuit board designs such as 6 layer rigid-flex PCB 2 layer flex stiffener. The use of rigid-flex PCBs is not that new. However, over the last few years, there has been a lot of improvement in it, in terms of technology. Also, with the size of the electronic devices shrinking, the demand for small-sized circuitry with more features has increased. Rigid-flex PCBs enable rigid, as well as flex PCB manufacturers to get the best of both worlds and offer endless configurations based on this integration. Rigid-flex PCBs have a huge application in almost all circuitries used across industries including defense, medical devices, electronic devices, and cameras.

For the 6 layer rigid-flex PCBs, we at Rigiflex provide 2 layers of flex stiffeners for additional support. These stiffeners reinforce the areas of the PCB that comprise flexible circuitry. They are designed to support the various components on the board, thus increasing the PCB’s durability. They are especially useful in the mounting of the PCB in an application. The flex stiffeners can also be used to perform specific functions such as heat dissipation and strain relief. At Rigiflex, we provide flex stiffeners for single as well as double sided boards. We can provide stiffeners on the top as well as bottom side of the flexible circuit. We can custom design the thickness of the stiffener as per your requirements.

6 Layer Rigid-Flex PCB with 2 Layer Flex PCB and Stiffener
Model:	Rigid-flex board-6L
Layers:	6
Material:	FR4+Polyimide
Surface treatment:	HARD GOLD+ENIG
Width/space:	4/4 mil
Finish thickness:	0.3mm(flex),1.6mm
Min Hot:	0.3mm

The insulation resistance of 6 layer rigid-flex PCB with 2 layer flex stiffener is up to 1000 MW and the dielectric strength is 5 KV. Their solder heat resistance is 260 .C/10secs or 210 .C/3secs. These PCBs have a water absorption rate from 1 to 2.9% depending on a variety of other factors.

SPECIFICATION
Materials	Polyimide	Polyester ( PET)	Remark&
(Kapton)	Test Method
		1~20(Rigid-Flex & Multilayers FPC)	1~2
	Single Sided	0.050 mm
	Double Sided	0.075 mm
	Drilling P.T.H.	0.2 mm
	Punching	1.0 mm
	Conductor Width (W)	0.025 mm		W0.5mm
	Hole Diameter (H)	0.05 mm (withP.T.H.0.1mm)		H1.5mm
	Accumulated Pitch (P)	0.05 mm (Special0.03mm)		P25mm
	Outline Dimension (L)	0.05 mm		L50 mm
	Conductors and Outline (C)	0.15 mm (Special 0.07mm)		C5.0 mm
	Conductors and Coverlay	0.3~0.5 mm
Surface Treatment on		Soft or Hard Ni/Au Sn/Pb (2~60µm) Primary FluxCarbon Printed 4~10µm Silver Gel printed
Terminals and land Areas
Insulation Resistance		1000MW		IPC-TM-650 2.6.3.2
				at Ambient
Dielectric Strength		5KV		IPC-TM-650 2.5.6.1
Surface Resistance (W)		5×012	2×015	IPC-TM-650 2.5.17
Volume Resistivity (W-cm)		1×015	1×015	IPC-TM-650 2.5.17
Dielectric Constant (1 MHz)		4	3.4	IPC-TM-650 2.5.5.3
Dissipation Factor (1 MHz)		0.04	0.02	IPC-TM-650 2.5.5.3
Peeling Strength (180 irection)		1.2kgf/cm	1.2kgf/cm	IPC-TM-650 2.4.9
Solder Heat Resistance		260 .C/10secs	210 .C/3secs
Flammability		94 V-0	94VTM-0	UL94
Water Absorption		2.90%	1.00%	ASTM D570%
				(24 Hours)