6 Layer Rigid-Flex PCB with 3 mil line/3 mil space with kapton stiffener

Rigid flex printed circuit boards, which is a combination of rigid and flexible PCB’s, play a critical role in the area of electrical interconnectivity. At Rigiflex Technology, Inc., we offer comprehensive design and engineering services when it comes to rigid flex circuit board. With leading edge technologies and innovation, we provide several models of rigid printed circuit boards, and one amongst the widely popular types we sell is 6 layer rigid-flex PCB with 3 mil line/3 mil space with Kapton stiffener. As your leading rigid printed circuit board manufacturer, the team here at Rigiflex brings you with the finest quality boards with Kapton stiffener to meet the demands of many new age products.

We, at Rigiflex, own the capabilities and highly experienced manufacturing personnel to design and assemble rigid-flex PCBs with heavy copper and exotic materials. We have gained an excellent reputation for outstanding work in configuring the PCB with precise copper mil lines and mil spaces. Since the performance of rigid flex PCBs depends on the substrate material used, we ensure to use high quality materials, especially Polyimide and Kapton in the production of 6 layer rigid-flex PCB with 3 mil line/3 mil space boards. To enhance the strength of the board, we also utilize a variety of Kapton stiffeners. The use of Kapton as the stiffener provides a number of advantages when building the PCB. As a material, Kapton provides immense stability even in the most extreme ranges of temperature. It is flame retardant, as well as chemical and radiation resistant, thus reducing rework and replacement expenditure. It does not require cleaning or maintenance, which helps to maintain productivity.

6 Layer Rigid-Flex PCB with 3 mil line/3 mil space with kapton stiffener
Model:	Rigid-flex board-6L
Layers:	6
Material:	FR4+Polyimide
Surface treatment:	HARD GOLD+ENIG
Width/space:	4/4mil
Finish thickness:	0.3mm(flex),1.6mm
Min Hot:	0.3mm

Our unmatched technical, engineering, highest standards of workmanship and customer services give us a competitive advantage in the marketplace. Being a flexible printed circuit board manufacturer, we are well equipped to meet the specifications provided by the customer. We can produce 6 layer rigid-flex PCB with 3 mil line/3 mil space with Kapton stiffener boards in thickness ranging from 0.5mm~3.0mm (0.02″~0.12″), copper thickens Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ, and width/space: 4/4mil. We offer the flexibility to choose solder mask colors from white/black/blue/green/red, Taiyo PSR4000 white and legend/silkscreen color between black/white. We are also experts in providing HARD GOLD+ENIG Surface treatment and Immersion Gold, HASL, OSP surface finishing to 6 layer rigid-flex PCB with 3 mil line/3 mil space with Kapton stiffener boards. Manufactured with dependable reliability, our 6 layer boards with Kapton stiffener can be customized to best meet your application requirements. As a prominent flex PCB manufacturer, we leverage our several years of experience and knowledge to produce the high performing rigid-flexible printed circuit boards on the market keeping the needs of our customers in mind.

OEM Custom Service
Board Thickness	:0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:	0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline:	Routing, punching, V-Cut
Solder mask:	White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color:	Black/White
Surface finishing:	Immersion Gold, HASL, OSP
Max Panel size:	18″*24″
Packing:	Vacuum/Plastic bag
Layer:	1 – 20 layers

SPECIFICATION
Materials		Polyimide	Polyester ( PET)	Remark&
		(Kapton)		Test Method
		1~20(Rigid-Flex & Multilayers FPC)	1~2
	Single Sided	0.050 mm
	Double Sided	0.075 mm
	Drilling P.T.H.	0.2 mm
	Punching	1.0 mm
	Conductor Width (W)	0.025 mm		W0.5mm
	Hole Diameter (H)	0.05 mm (withP.T.H.0.1mm)		H1.5mm
	Accumulated Pitch (P)	0.05 mm (Special0.03mm)		P25mm
	Outline Dimension (L)	0.05 mm		L50 mm
	Conductors and Outline (C)	0.15 mm (Special 0.07mm)		C5.0 mm
	Conductors and Coverlay	0.3~0.5 mm
Surface Treatment on		Soft or Hard Ni/Au Sn/Pb (2~60µm) Primary FluxCarbon Printed 4~10µm Silver Gel printed
Terminals and land Areas
Insulation Resistance		1000MW		IPC-TM-650 2.6.3.2
				at Ambient
Dielectric Strength		5KV		IPC-TM-650 2.5.6.1
Surface Resistance (W)		5×012	2×015	IPC-TM-650 2.5.17
Volume Resistivity (W-cm)		1×015	1×015	IPC-TM-650 2.5.17
Dielectric Constant (1 MHz)		4	3.4	IPC-TM-650 2.5.5.3
Dissipation Factor (1 MHz)		0.04	0.02	IPC-TM-650 2.5.5.3
Peeling Strength (180 irection)		1.2kgf/cm	1.2kgf/cm	IPC-TM-650 2.4.9
Solder Heat Resistance		260 .C/10secs	210 .C/3secs
Flammability		94 V-0	94VTM-0	UL94
Water Absorption		2.90%	1.00%	ASTM D570%
				(24 Hours)