Flex & Rigid-Flex PCBs.. 1-5 Day Quick Turn
Superior & Trusted Flexible, Rigid-Flex & Rigid PCBs for Over 25 years
Rigiflex is one of the leading and experienced manufacturers of rigid-flex printed circuit boards (PCBs) in the US. We add gold plating to the PCBs, which helps strengthen the design and manufacture of the PCBs. Gold plating is most commonly done for edge connectors, as well as membrane switches. If you want to protect the components of your PCBs from wear and tear, and make them last for several years together, then electroplated gold at 300 micro inches is used. We also provide rigid PCBs with solder plating to enhance the imaging process. Solder plating is only applicable to those boards that are not coated with solder masks. Also, solder plating can be done on those boards, over which components are hand soldered and assembled. If proper maintenance is done, then this solder plating has the capability to last for a number of years.
The 14 layer rigid-flex circuit boards that we manufacture come with gold and solder plating. The surface finishing of these printed circuit boards is of gold. However, you can also select from other surface finish options, which include HASL, lead-free HASL, Immersion Gold/Tin/Silver, OSP, flash gold, gold fingers, plating hard gold, and peelable mask. We have the capability to provide you 14 layer rigid-flex circuit boards with a total board thickness of 2.0 mm. The base material used for these circuit boards is FR4 TG170, which is a glass fabric-based epoxy resin copper clad laminate. The minimum solder mask clearance that we provide is 0.05 mm.
14 Layer Rigid Flex Circuit Boards with Gold and Solder Plating | |
Model | 14L PCB |
Base Material: | 14L,FR4, TG170 |
Board Thickness: | 2.0 mm |
Copper Thickness: | 1/H…H/1OZ |
Min. Hole Size: | 3mil (0.076mm) |
Min. Line Width/ Spacing: | 3/3 mil |
Solder mask/ Silkscreen Color: | Green/White |
Surface Finishing: | Gold |
Rigid PCB Capability | |||
No. | Item | Technical data | |
1 | Layer Count | 1-30Layers | |
2 | HDI Type | 1+N+1, 2+N+2 | |
3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc | |
4 | Board thickness | 0.2~5.0mm | |
5 | Board Size | Max. | 18”x24” |
Min. | 30x50mm | ||
6 | Copper Thickness | Outer layer | 1oz~6oz |
Inner layer | Hoz~5oz | ||
7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
8 | Finished Hole size | Mechanical | 0.20~6.30mm |
Laser | 5mil, 6mil | ||
9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
10 | Aspect Ratio | 10:1 | |
11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
NPTH | ±0.05mm (2mil) | ||
12 | Hole Position Tolerance | ±0.05mm (2mil) | |
13 | Bow & Twist | ≤0.75% | |
14 | Peel strength | 1.4N/mm | |
15 | Thermal stress | 288℃ & 20 Sec | |
16 | Test Voltage | 50-300V | |
17 | Soldermask color | Green, Red, Blue, Black, White | |
18 | Silkscreen color | White, Black, Yellow | |
19 | Min. S/M Pitch | 4mil(0.1mm) | |
20 | Min. Solder Mask Clearance | 0.05mm | |
21 | Impedance Control Tolerance | +/-10% | |
22 | Outline Tolerance | ±0.10mm (4mil) | |
23 | Surface Finish | HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask |