Flex & Rigid-Flex PCBs.. 1-5 Day Quick Turn
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Rigid flex printed circuit boards are the talk of the day. These boards are being used in a wide range of applications, owing to the several benefits that they offer. These PCBs can come in different layer options, depending upon the application. Rigiflex, is one of the leading manufacturers of 2 layer rigid flex PCBs made from Teflon material. Teflon material has a low dielectric constant, high melting temperature, and is non-viscous in nature.
In high frequency applications, the FR4 manufactured printed circuit boards can cause electrical loss. This is not the case with the Teflon PCBs. Thus, the Teflon PCBs are considered to be the best replacement for the FR4 circuit boards. There are several reasons for the increasing popularity of these printed circuit boards. These reasons are basically the benefits, such as heat resistance, corrosion resistance, and an exceptional resistance to abrasion, and moisture.
We have the capability to manufacture these boards with a thickness of 1.6 mm, and copper thickness of 1 oz. The surface finish of these 2-layer Teflon printed circuit boards is done using lead-free HASL material. Other materials in which we can provide you surface finish, include HASL, OSP, immersion gold/tin/silver, plating hard gold, gold fingers, peelable mask, and carbon ink. You can select the solder mask color from options, such as black, white, red, blue, and green.
We, at Rigiflex, can provide you these PCBs with varied capabilities and specifications that are an exact match to your requirements. Out 2-layer Teflon PCBs are free of silkscreens and solder masks. The best part is that we make these PCBs available to you at competitive prices. You can rest assured about the quality of printed circuit boards that we manufacture, as we have certifications from PCB manufacturing industry, such as Aerovironment, and ITAR registered.
2 Layer Teflon Rigid Flex Circuit Boards | |
Model: | 2L PCB |
Base Material: | 1L, FR4 |
Board Thickness: | 1.6 mm |
Copper Thickness: | 1OZ |
Min. Hole Size: | 5mil (0.125mm) |
Min. Line Width/ Spacing: | 4/4 mil |
Solder mask/ Silkscreen Color: | No soldermask / no silkscreen. Lowest cost way. |
Surface Finishing: | HASL Lead Free |
Rigid PCB Capability | |||
No. | Item | Technical data | |
1 | Layer Count | 1-30Layers | |
2 | HDI Type | 1+N+1, 2+N+2 | |
3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc | |
4 | Board thickness | 0.2~5.0mm | |
5 | Board Size | Max. | 18”x24” |
Min. | 30x50mm | ||
6 | Copper Thickness | Outer layer | 1oz~6oz |
Inner layer | Hoz~5oz | ||
7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
8 | Finished Hole size | Mechanical | 0.20~6.30mm |
Laser | 5mil, 6mil | ||
9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
10 | Aspect Ratio | 10:1 | |
11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
NPTH | ±0.05mm (2mil) | ||
12 | Hole Position Tolerance | ±0.05mm (2mil) | |
13 | Bow & Twist | ≤0.75% | |
14 | Peel strength | 1.4N/mm | |
15 | Thermal stress | 288℃ & 20 Sec | |
16 | Test Voltage | 50-300V | |
17 | Soldermask color | Green, Red, Blue, Black, White | |
18 | Silkscreen color | White, Black, Yellow | |
19 | Min. S/M Pitch | 4mil(0.1mm) | |
20 | Min. Solder Mask Clearance | 0.05mm | |
21 | Impedance Control Tolerance | +/-10% | |
22 | Outline Tolerance | ±0.10mm (4mil) | |
23 | Surface Finish | HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask |