Flex & Rigid-Flex PCBs.. 1-5 Day Quick Turn
Superior & Trusted Flexible, Rigid-Flex & Rigid PCBs for Over 25 years
At Rigiflex, we manufacture high-quality printed circuit boards (PCBs) of different types. One such most popular type of PCBs that we provide is the 6 layer rigid-flex polyimide circuit board. For manufacturing these PCBs, we make use of the FR4 and TG135 as the base materials of these boards. The polyimide material offers excellent mechanical properties and possess ability to resist heat. Besides this, the material is known to have some really good properties, such as thermal stability, high chemical resistance. Also, this material has an excellent tensile strength, which makes the material perfectly suited for the PCBs.
We, at Rigiflex, have the capability to manufacture rigid-flex printed circuit boards, with a total board thickness of 1.6 mm. The thermal stress that these PCBs can handle is 288 °C & 20 Sec. The finished hole size by a laser can be 5 mil, or 6 mil. We give you an option to choose from our wide ranging solder masks, which include color options like white, green, blue, black, and red. You can also select the desired silkscreen color from black, yellow, and white. The copper thickness of these circuit boards that we manufacture is 1 OZ. The minimum hole size that we offer is 4 mil. The peel strength of the 6 layer rigid-flex polyimide circuit boards is 1.4 N/mm. We provide a vast variety of surface finish options, which include HASL, lead-free HASL, immersion gold/tin/silver, OSP, flash gold, gold fingers, plating hard gold, and peelable mask.
6 Layer Rigid Flex Circuit Board Polyimide | |
Model: | 6L PCB |
Base Material: | 6L, FR4,TG135 |
Board Thickness: | 1.6 mm |
Copper Thickness: | 1OZ |
Min. Hole Size: | 4mil |
Min. Width/Gap: | 4/5 mil |
Surface Finishing: | Gold |
Rigid PCB Capability | |||
No. | Item | Technical data | |
1 | Layer Count | 1-30Layers | |
2 | HDI Type | 1+N+1, 2+N+2 | |
3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc | |
4 | Board thickness | 0.2~5.0mm | |
5 | Board Size | Max. | 18”x24” |
Min. | 30x50mm | ||
6 | Copper Thickness | Outer layer | 1oz~6oz |
Inner layer | Hoz~5oz | ||
7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
8 | Finished Hole size | Mechanical | 0.20~6.30mm |
Laser | 5mil, 6mil | ||
9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
10 | Aspect Ratio | 10:1 | |
11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
NPTH | ±0.05mm (2mil) | ||
12 | Hole Position Tolerance | ±0.05mm (2mil) | |
13 | Bow & Twist | ≤0.75% | |
14 | Peel strength | 1.4N/mm | |
15 | Thermal stress | 288℃ & 20 Sec | |
16 | Test Voltage | 50-300V | |
17 | Soldermask color | Green, Red, Blue, Black, White | |
18 | Silkscreen color | White, Black, Yellow | |
19 | Min. S/M Pitch | 4mil(0.1mm) | |
20 | Min. Solder Mask Clearance | 0.05mm | |
21 | Impedance Control Tolerance | +/-10% | |
22 | Outline Tolerance | ±0.10mm (4mil) | |
23 | Surface Finish | HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask |